According to the latest report of 1Q17 Micro LED next-generation display technology market members by LEDinside, a division of TrendForce, the key technology development direction of Micro LED covers four aspects, including epitaxy and chip technology, transfer technology, and bonding technology (Bonding). , color scheme, etc.
transfer technology
The core technology of thin film transfer is how to capture a large number of micron-scale thin film epitaxy. The current grasping methods can be roughly divided into grasping methods based on physical characteristics, or grasping methods based on chemical materials. Taking physical grasping as an example, LuxVue adopts the method of attracting tiny components through electrostatic force. The chemical grasping is represented by X-Celeprint, using Elastomer Stamp as the medium, and van der Waals force for grasping. In addition, there are many manufacturers who have developed many kinds of grabbing methods.
Another core technology of thin film transfer is how to choose the micron-scale thin film epitaxy that you want to grab. For example, most of them use the size of the grab force to control the target to be selected. Or Van der Waals force, and choose to apply different levels of energy to the target you want to grab. In addition, SONY also uses laser burning to select specific targets.
Finally, it is generally used to connect the internal circuit of the led wall outdoor display (click through the next internet site) (click through the next internet site) chip to the substrate with a gold wire before packaging and conduct the circuit. However, since the chip of Micro LED is too small, there is no way to combine it with the substrate by the usual metal bonding method, so it needs to use other methods to integrate with the substrate. Therefore, the future technology development will focus on what kind of materials are used for bonding and transfer.
